| 摘要 |
<P>PROBLEM TO BE SOLVED: To achieve the reliability up to 200°C in an electronic package configured by sealing a mounted body in which an electronic element is fixed on a metal member with a molded resin composed of an epoxy resin. <P>SOLUTION: The electronic package includes: a mounted body 50 having metal members 10, 11 composed of metal and a semiconductor element 20 bonded to the metal members 10, 11; a molded resin 60 which is composed of an epoxy resin and seals the mounted body 50; and a primer 70 composed of a resin that assures the adhesion between the mounted body 50 and the molded resin 60 by being interposed between the both 50, 60, wherein the glass transition temperatures of the molded resin 60 and of the primer 70 are 200°C or higher. <P>COPYRIGHT: (C)2008,JPO&INPIT |
