发明名称 MOUNTING STRUCTURE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a mounting structure that sufficiently maintains strength against each load in a bending direction, in a torsion direction, and in a tensile direction without newly providing a reinforcing connection part. <P>SOLUTION: Bonding strength is secured by executing mounting while sandwiching a flexible wiring board 103 between an FPC-connecting electrode pad 105 on a printed wiring board 101 and an FPC-connecting electrode pad 106 on a printed wiring board 102. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2008140941(A) 申请公布日期 2008.06.19
申请号 JP20060324930 申请日期 2006.11.30
申请人 OLYMPUS CORP 发明人 OHARA SATOSHI
分类号 H05K1/14;H05K3/46 主分类号 H05K1/14
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