发明名称 |
Lead-Frame Circuit Package |
摘要 |
A lead-frame circuit package comprises a die and a substrate located thereon to route radio frequency signals to/from the die. The package preferably comprises an exposed pad on the die to receive a power amplifier device wherein the substrate is used to provide high-Q elements such as RF chokes on signal paths to/from the power amplifier device. In this manner, the design benefits from the power capabilities and improved grounding of a lead-frame conductor, whilst also achieving the routeing capabilities and small scale advantages provided by a multi-layer printed circuit substrate.
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申请公布号 |
US2008142935(A1) |
申请公布日期 |
2008.06.19 |
申请号 |
US20050816038 |
申请日期 |
2005.02.24 |
申请人 |
FREESCALE SEMICONDUTOR, INC. |
发明人 |
MONTORIOL GILLES;DELAUNAY THIERRY;TILHAC FREDERIC |
分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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