IN-LINE SYSTEM FOR MANUFACTURING SEMICONDUCTOR PACKAGES

摘要

An in-line system for manufacturing a semiconductor package using a liquid adhesive application onto a rear of a wafer is provided to prevent the warpage of the wafer by coating a liquid adhesive agent on the wafer to form an adhesive layer. A loading unit(12) loads a wafer. A back-lap unit(14) polishes a rear of the wafer transferred from the loading unit by using a grinder. A cleaning unit(16) includes an air pressure plasma generating apparatus. The cleaning unit cleans the wafer polished in the back-lap unit by using air pressure plasma. An applying unit(18) applies a liquid adhesive agent to the rear of the wafer cleaned by the cleaning unit by using a nozzle to form adhesive layers. An attaching unit(24) attaches a dicing tape to the adhesive layer formed on the wafer. An unloading unit(26) unloads the wafer on which the adhesive layer is formed. A transfer unit(28) transfers the wafer to the loading unit, the back-lap unit, the cleaning unit, the applying unit, the attaching unit, and the unloading unit, sequentially.