发明名称 METHOD OF FORMING A PATTERN AND METHOD OF MANUFACTURING A CAPACITOR USING THE SAME
摘要 A pattern forming method and a capacitor forming method using the same are provided to remove a buffer film pattern with an oxide film pattern by performing a wet-etching process after a conductive film pattern is formed. An oxide film pattern with an aperture is formed on a substrate. A conductive film with a uniform thickness is formed on the oxide film pattern having the aperture. A buffer film pattern(266) is buried in the aperture of the oxide film pattern, where the conductive film is formed. The buffer film pattern contains a siloxane polymer with a predetermined structural expression. The conductive film is removed from the oxide film pattern by using the buffer film pattern as an etching mask.
申请公布号 KR100839360(B1) 申请公布日期 2008.06.19
申请号 KR20060129346 申请日期 2006.12.18
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, KYOUNG MI;KIM, YOUNG HO;KIM, MYUNG SUN;KIM, JAE HO;LEE, CHANG HO;HAN, SEOK
分类号 H01L27/04;H01L27/108 主分类号 H01L27/04
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