| 发明名称 |
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of realizing three-dimensional packaging and improving reliability of electric connection, and to provide a manufacturing method thereof. <P>SOLUTION: Gold bumps 26 are formed on an aluminum electrode 12 of a silicon carbide element 11 by a ball bump method under a condition that the temperature of a bonding stage 30 is set at a range of 100°C-460°C. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
| 申请公布号 |
JP2008140857(A) |
申请公布日期 |
2008.06.19 |
| 申请号 |
JP20060323694 |
申请日期 |
2006.11.30 |
| 申请人 |
NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL &, TECHNOLOGY |
发明人 |
LANG FENGQUN;HAYASHI YUSUKE;NAKAGAWA HIROSHI;AOYANAGI MASAHIRO;OHASHI HIROMICHI |
| 分类号 |
H01L21/60;H01L23/48 |
主分类号 |
H01L21/60 |
| 代理机构 |
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