发明名称 |
Method for forming a semiconductor structure |
摘要 |
A method for semiconductor structure formation includes: providing a substrate; forming a first lower mask layer on the substrate; forming a first patterned mask on the first lower mask layer; forming a second lower mask layer on the first lower mask layer and overlaying the first patterned mask; forming a second patterned mask on the second lower mask layer without the second patterned mask overlapping the first patterned mask; etching and undercutting the first lower mask layer and the second lower mask layer to form the third patterned mask with the first patterned mask and the second patterned mask; etching the substrate by using the third patterned mask to form a plurality of islands; and removing the third patterned mask.
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申请公布号 |
US2008146031(A1) |
申请公布日期 |
2008.06.19 |
申请号 |
US20070000538 |
申请日期 |
2007.12.13 |
申请人 |
NANYA TECHNOLOGY CORPORATION |
发明人 |
LIU HUNG JEN;HSIEH WEI HSIEN;YEH CHANG-HO |
分类号 |
H01L21/461 |
主分类号 |
H01L21/461 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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