| 摘要 |
In order to be able to measure topographies on wafers or devices in a fashion free from destruction, the invention provides a method for measuring three-dimensional topographic structures ( 22 ) on wafers ( 2 ) or devices in which with the aid of a confocal microscope ( 1 ) at least one fluorescing topographic structure ( 22 ) is scanned with excitation light, and the fluorescence light emitted from the focal point ( 17 ) in the focal plane ( 19 ) of the objective ( 15 ) and excited by the excitation light is detected, and measured data are obtained from the position of the focal point ( 17 ) and the detected fluorescence signal.
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