发明名称 METHOD AND APPARATUS OF BONDING HOT FIX FOR ORNAMENT
摘要 A method and an apparatus of bonding the hot fix for ornament are provided to reduce the badness due to the attachment of the hot fix significantly and to reduce the manufacturing cost. An array plate(100) has seating holes(120) for seating plural hot fixes(21) in order to form a predetermined pattern. A cushion member(500) is located at the lower portion of the array plate and compressed according to the compression force applied from the upper portion. The cushion member forms a protrusion portion to the inside of the seating holes of the array plate. An adhesion sheet(300) is located at the upper portion of the array plate. The upper surface of the hot fix is adhered to an adhesion layer(310) formed at the lower portion of the adhesion sheet. An elevating plate(600) is located at the upper portion of the adhesion sheet and moved up and down. A vibration generator is installed at the array plate and generates the vibration so that the hot fixes are arrayed into the inside of the seating holes. Further, a vibration generator for arraying the hot fix into the seating holes is installed at the array plate.
申请公布号 KR100838596(B1) 申请公布日期 2008.06.19
申请号 KR20070126939 申请日期 2007.12.07
申请人 HOYUNG, DUK HAUI 发明人 HOYUNG, DUK HAUI
分类号 D06Q1/10;D06Q1/00 主分类号 D06Q1/10
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