RADIATION SENSOR

摘要

PROBLEM TO BE SOLVED: To provide an improved radiation sensor.

SOLUTION: A plurality of thermopiles are formed on one wafer and a plurality of packages for the thermopiles are formed inside another wafer. Each package includes a formed well covered by a window. These two wafers are bonded in a controlled gas or vacuum environment, such that each thermopile is located inside the well below the window of a package.

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