发明名称 METHOD FOR MANUFACTURING SPUTTERING TARGET PROVIDED WITH BACKING PLATE
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a sputtering target provided with a backing plate, by jointing a blank of a discoidal target with a blank of a backing plate. SOLUTION: The method for manufacturing the sputtering target provided with the backing plate includes the steps of: overlapping the blank 1 of the discoidal target made of a metal having high hardness and having protrusions 21 on one side, on the blank 3 of the discoidal backing plate made of a metal having lower hardness than that of the blank 1 of the discoidal target and having superior heat conductivity so that the protrusions 21 on the blank of the discoidal target contacts with the blank of the discoidal backing plate; and then pressure-jointing the sputtering target with the backing plate. All apexes 7 of the protrusions 21 formed on one side of the blank of the discoidal target are tilted towards the center of the blank of the discoidal target. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008138274(A) 申请公布日期 2008.06.19
申请号 JP20060327987 申请日期 2006.12.05
申请人 MITSUBISHI MATERIALS CORP 发明人 OTOMO KENJI;ODA JUNICHI
分类号 C23C14/34 主分类号 C23C14/34
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