发明名称 PACKAGE STRUCTURE
摘要 A package structure including a first lead, a second lead, an encapsulant, a light-emitting device and an electrostatic discharge (ESD) protection device is provided. The second lead is disposed beside the first lead, and parts of the first lead and the second lead are encapsulated by the encapsulant. The encapsulant has a first cavity and a second cavity. Parts of the first lead and the second lead are exposed by the first cavity and the other parts of the first lead and the second lead are exposed by the second cavity. The light-emitting device is disposed inside the first cavity and electrically connected to the first lead and the second lead. The ESD protection device is disposed inside the second cavity and electrically connected to the first lead and the second lead.
申请公布号 US2008142831(A1) 申请公布日期 2008.06.19
申请号 US20070684644 申请日期 2007.03.12
申请人 LIGHTHOUSE TECHNOLOGY CO., LTD 发明人 SU WEN-LUNG
分类号 H01L33/48;H01L33/62 主分类号 H01L33/48
代理机构 代理人
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