| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing device improved in precision in processing a wafer. <P>SOLUTION: In this polishing device, a control part controls operation of a liquid supply part for feeding a liquid (demineralized water) into a groove part of a suction member 51 until the wafer 30 is conveyed above at least the suction member 51 by a conveyance device 100 and controls operation of the conveyance device 100 to convey the wafer 30 up to a first upper position A positioned above the suction member 51, lower the wafer 30 down to a second upper position B positioned above the suction member 51 and below the first upper position A from the first upper position A at a first speed, and lower the wafer 30 down onto an upper face of the suction member 51 from the second upper position B at a second speed being lower than the first speed. <P>COPYRIGHT: (C)2008,JPO&INPIT |
