发明名称 FIXING METHOD OF PIEZOELECTRIC VIBRATION PLATE
摘要 PROBLEM TO BE SOLVED: To solve the problem that contact with a recessed space inside surface, of a part of a piezoelectric vibration plate obstructs vibrating movements of the piezoelectric vibration plate to have possibility of giving a bad influence upon vibration characteristics of the piezoelectric vibration plate because it is difficult to steadily keep a position of shorter-side end parts not fixed with a conductive adhesive, of the piezoelectric vibration plate in a recessed space, so as not to touch to the recessed space inside surface. SOLUTION: A fixing method of the piezoelectric vibration plate includes: a step of simultaneously applying a first conductive adhesive and a second conductive adhesive having a shrinkage rate higher than that of the first conductive adhesive when solidified, onto electrode pads for element connection in a series form parallel with longer sides of the piezoelectric vibration plate so that the first conductive adhesive is applied on the side of one shorter side of a recessed space bottom and the second conductive adhesive is applied on the side of the other shorter side of the recessed space bottom; a step of disposing the piezoelectric vibration plate on these conductive adhesives; and a step of solidifying these conductive adhesives to fix and electrically connect the piezoelectric vibration plate and the electrode pads for element connection through the first and second conductive adhesives. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008141418(A) 申请公布日期 2008.06.19
申请号 JP20060324810 申请日期 2006.11.30
申请人 KYOCERA KINSEKI CORP 发明人 MANKO SEIYA
分类号 H03H3/02;H03H9/10 主分类号 H03H3/02
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