| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technique capable of making a semiconductor package into individual pieces at a high speed. <P>SOLUTION: A collectively sealed body 9 is confronted with adsorption blocks KBC; a substrate matrix 1 is placed on the stage; vacuum suction is performed from suction holes KTA, and the collectively sealed body 9 (substrate matrix 1) is adsorbed on the adsorption blocks KBC. In this conditions, a laser LS1 is applied and scanned, and the substrate matrix 1 and the collectively sealed body 9 are cut. During the radiation and scanning of the laser LS1, the dust of the substrate matrix 1 and the collectively sealed body 9 generated during the cutting operation is sucked by vacuum suction by a dust collection groove SJM provided at the stage. <P>COPYRIGHT: (C)2008,JPO&INPIT |
