| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component mounting apparatus capable of mounting electronic components so as to correspond to the warpage of a printed board only requiring a very short measurement time. <P>SOLUTION: Upon completion of positioning operation of a printed board P, a CPU controls an X-axis motor and a Y-axis motor to move a mounting head and a detecting device. In this case, the CPU performs control so that the detector can move to the upper part of the detection position as a position stored in a RAM where the printed board P has the largest warpage. After the height level of the printed board P is detected and a detection value is stored in a RAM, the CPU determines whether or not the detection value is within a permissible range stored in the RAM. When determining that the value is within the range, the CPU controls a suction nozzle so that electronic components can be mounted on the printed board without detecting the height level of other positions stored in the RAM. <P>COPYRIGHT: (C)2008,JPO&INPIT |
