| 摘要 |
PROBLEM TO BE SOLVED: To appropriately realize compatibility between crack prevention of molded resin and prevention of resin burr on the surface from which a heatsink is exposed with respect to a semiconductor which is formed by sealing the heatsink, an IC chip, and a lead frame with resin so that they may be wrapped around. SOLUTION: The semiconductor device 100 includes the heatsink 10, the IC chip 20 which is mounted and fixed on one side 11 of the heatsink 10, the lead frame 40 which surrounds the IC chip 20 and is electrically connected to the IC chip 20 and the molded resin 60 which seals them so that it may wrap them around. The other side 12 of the heatsink 10 is exposed from the molded resin 60. In this case, a specific surface area of a portion H1 of the surface of the heatsink 10 sealed with the molded resin 60 to a portion H2 exposed from the molded resin 60 is 1.14 or more and 1.32 or less. COPYRIGHT: (C)2008,JPO&INPIT
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