| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive composition giving a cured material having excellent gas tightness, free from the pollution of the inside of a closed vessel and having excellent handleability. SOLUTION: The adhesive composition contains (A) an aromatic epoxy resin having a softening point of 50-100°C and (B) a phenolic resin of an amount to give a molar ratio of the phenolic hydroxyl group to the epoxy group of the component (A) of 0.8-1.2 and having a softening point of 50-100°C. COPYRIGHT: (C)2008,JPO&INPIT
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