| 摘要 |
The invention relates to a method for separation of a silicon wafer ( 12 a) from a vertical stack ( 10 ) of silicon wafers ( 12 ). The method is characterised in that it comprises attaching a movable transport device ( 2 ) to a surface of the silicon wafer ( 12 a) in the stack ( 10 ), and horizontal movement of the silicon wafer ( 12 a) parallel (A) to the surface of the silicon wafer ( 12 a) until the silicon wafer ( 12 a) is separated from the stack ( 10 ). The invention also comprises a device for implementing the method.
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