LEAD-FREE SOLDER ALLOY FOR PRINTED CIRCUIT BOARD ASSEMBLIES FOR HIGH-TEMPERATURE ENVIRONMENTS

摘要

A solder alloy suitable for high temperature environments, such as for example electronic systems used in an oil or gas well where the temperature may be in the region of 175°C, the solder alloy having a Silver weight % in the range of 3.5 to 7.0, a Copper weight % in the range of 1.0 to 4.0, and an Antimony weight % in the range of 1.0 to 3.0. Other embodiments are described and claimed.