METHOD AND APPARATUS OF SUPPLYING CHEMICAL AND, APPARATUS OF MANUFACTURING INTEGRATED CIRCUIT HAVING THE SAME

摘要

A method for supplying chemicals is provided to sufficiently reduce variation of the temperature of process chemicals caused by the temperature of a substrate itself by supplying temperature compensation chemicals to the back surface of the substrate when process chemicals are supplied to the surface of the substrate. Process chemicals are supplied to the surface of a substrate(20) positioned on a chuck(12) to perform a process on the substrate. Temperature compensation chemicals having a similar temperature to that of the process chemicals are supplied to the back surface of the substrate so that it is compensated that the temperature variation of the process chemicals caused by the temperature of the substrate itself when the process chemicals are supplied to the surface of the substrate. When the substrate is placed on the chuck, a space can be formed between the back surface of the substrate and the chuck.