| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing semiconductor chips for a stacked chip, in which even when the thickness of each semiconductor chip is thin, the semiconductor chip is not easily damaged in a stacked chip composed of stacking a plurality of semiconductor chips and the highly reliable stacked chip can be provided. SOLUTION: In the case of segmenting individual semiconductor chips 8, 9 from a wafer 1 and obtaining structure forming an adhesive layer 10 or 11 for forming a stacked chip on the semiconductor chips 8, 9 in the method for manufacturing semiconductor chips for a stacked chip; the wafer 1 is diced by dicing at first to obtain the individual semiconductor chips 8, 9, and then the adhesive layers 10, 11 are formed on the upper surface of the semiconductor chips 8, 9 on a dicing tape 6 while excluding electrically conductive portions to obtain the semiconductor chips 8, 9 on which the adhesive layers 10, 11 are stacked. COPYRIGHT: (C)2008,JPO&INPIT
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