| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To effectively reduce the area of a semiconductor integrated circuit requiring a large number of pads. <P>SOLUTION: In a semiconductor integrated circuit 5, an internal circuit 4 is positioned in the center portion, and I/O circuits 1 and 2 for inputting/outputting signals from/to the outside and pads 3 are arranged along four sides of the semiconductor integrated circuit 5. The I/O circuits 2 are one-pad I/O circuits on which one pad 3 is arranged, whereas the I/O circuits 1 are two-pad I/O circuits on which two pads 3 are arranged in a zigzag manner in a direction toward the internal circuit 4. As a whole, the two types of I/O circuits are arranged, and the number of arranged pads 3 is equal to the number of required pads. The one-pad I/O circuits 2 and the two-pad I/O circuits 1 are provided with power source wires for supplying power thereto. The power source wires extend along the arrangement direction of the I/O circuits 1 and 2 to be ring-shaped. Power source wire migration areas A for changing power source wires between the one-pad I/O circuits 2 and the two-pad I/O circuits 1 are disposed in four corner portions C of the semiconductor integrated circuit 5. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
