| 摘要 |
An image read head is provided to reduce a crack in a junction part between an image sensor package and a circuit board due to the expansion or contraction of the image read head. A buffer member(30) is installed at one side of a surface of a circuit board(20) on which an image sensor package(10) is laid. When the image sensor package and the circuit board are expanded or contracted, the buffer member reduces impact provided to a junction part between the image sensor package and the circuit board. The buffer member is protruded from the surface of the circuit board to separate the image sensor package from the surface of the circuit board.
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