| 摘要 |
An apparatus and a method for treating a substrate are provided to increase the wafer throughput and decrease the foot print by equipping a lot of process chambers more than a conventional method. A substrate treatment apparatus comprises a transfer chamber(40), a plurality of process chambers(50) which is installed around the transfer chamber, a first and a second load lock chambers(32,34) which are installed around the transfer chamber, a load port(10) which settles a storage member for storing the plural substrates, and an EFEM(Equipment Front End Module)(20) which transfers the substrate between the load port and the first load lock chamber, and between the load port and the second load lock chamber. Wherein, the transfer chamber comprises a first and a second transfer chambers which are located adjacent to each other.
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