| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor light emitting device miniaturized by devising the location of connection pads. <P>SOLUTION: A second light emitting device 30 comprises a stripe-shaped semiconductor layer 32 which is formed by superposing with a first light emitting device 20 and is formed in the opposite surface side to the first substrate of the second substrate 31, a stripe-shaped p lateral electrode 36 which supplies current to the semiconductor layer 32, stripe-shaped opposed electrodes 42, 44 which are located one-by-one opposite to respective p lateral electrodes 26A, 26B of the first light emitting device 20, and electrically connected with each other, connection pads 46, 48 electrically connected with the respective opposed electrodes 42, 44, and a connection pad 39 electrically connected with the p lateral electrode 36. The connection pads 39, 46, 48 are located in parallel with the opposed electrodes 42, 44. <P>COPYRIGHT: (C)2008,JPO&INPIT |
