| 摘要 |
<P>PROBLEM TO BE SOLVED: To thin a noncontact type electronic tag, and to improve its reliability. <P>SOLUTION: An inlet 1 for the electronic tag is equipped with an antenna 3 comprising Cu foil stuck on one surface of a rectangular insulating film 2 comprising a polyimide resin film, and a semiconductor chip 5 connected to the antenna 3. A slit 7 whose one end reaches the fringe of the antenna 3 is formed approximately at the center of the antenna 3. Au bumps 9a, 9b and dummy Au bumps 9c, 9d constituting circuit terminals are formed on the main surface of the semiconductor chip 5, and the four Au bumps 9a, 9b, 9c and 9d are connected to a lead 10 formed integrally with the antenna 3. <P>COPYRIGHT: (C)2008,JPO&INPIT |
