| 摘要 |
PROBLEM TO BE SOLVED: To improve the connection reliability between a protruded structure and an electrode of a circuit element, in a circuit apparatus where a wiring layer, insulating resin, and the circuit element are stacked so as to embed the protruding structure in the insulating resin. SOLUTION: The circuit apparatus 100 includes a wiring layer 200, an insulating resin layer 130, several LSIs 110, and a passive component 120. The wiring layer 200 includes a protruding electrode 182, provided at a position corresponding to respective element electrodes of the LSI 110 and the passive component 120. The insulating resin layer 130 is formed with a material which causes plastic fluidity, when it is pressurized. The protruding electrode 182 penetrates the insulating resin layer 130 and is electrically connected to the corresponding element electrode. COPYRIGHT: (C)2008,JPO&INPIT |
