| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus and a substrate processing method, capable of improving throughput of substrate processing without increasing a manufacturing cost. SOLUTION: A substrate carrying robot CR and a shuttle carrying mechanism 3 are provided on a carrying region C. The shuttle carrying mechanism 3 is provided on a position spaced to the side from a line connecting the position of an indexer robot IR in delivery of a substrate W and the position of the substrate carrying robot CR in delivery of the substrate W. Namely, the shuttle carrying mechanism 3 is provided at a position where the rotation angle of the indexer robot IR is smaller than 180 degrees, between a carrying arm forward/backward direction in which the indexer robot IR accommodates and extracts the substrate W for a carrier 1 and a carrying arm forward/backward direction in which the indexer robot IR delivers the substrate W to the shuttle carrying mechanism 3. COPYRIGHT: (C)2008,JPO&INPIT
|
