| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive which does not cause the increase in connection resistance and the separation of the adhesive at a connection part and enables the production of a circuit board with a drastically improved connection reliability. SOLUTION: The adhesive for circuit member connection is caused to intervene in between circuit electrodes facing each other, electrically connects the circuit electrodes facing each other in the pressure direction by pressurizing the circuit electrodes, and is used for connecting an IC chip to a printed circuit board. The adhesive comprises a polyfunctional epoxy resin having at least three functional groups and/or an epoxy resin having a naphthalene backbone and exhibits, after its curing, an average thermal expansion coefficient of 200 ppm or lower at 120-140°C. COPYRIGHT: (C)2008,JPO&INPIT
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