发明名称 |
RAPID CONDUCTIVE COOLING USING A SECONDARY PROCESS PLANE |
摘要 |
A method and apparatus for thermally processing a substrate is described. The apparatus includes a substrate support configured to move linearly and/or rotationally by a magnetic drive. The substrate support is also configured to receive a radiant heat source to provide heating region in a portion of the chamber. An active cooling region comprising a cooling plate is disposed opposite the heating region. The substrate may move between the two regions to facilitate rapidly controlled heating and cooling of the substrate.
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申请公布号 |
US2008142497(A1) |
申请公布日期 |
2008.06.19 |
申请号 |
US20060611061 |
申请日期 |
2006.12.14 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
SORABJI KHURSHED;LERNER ALEXANDER N. |
分类号 |
H01L21/67;F27D11/00;F28F7/00;H01L21/477 |
主分类号 |
H01L21/67 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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