| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer substrate which decreases the stress acting on electronic components, embedded in the multilayer substrate and can suppress the electronic components from receiving damages. <P>SOLUTION: The height A of an electronic component 30 is smaller than the thickness B of a resin film 11c, formed with a through hole 15 for inserting the electronic part 30 (A<B). Accordingly, upon heating and pressurizing, the pressure applied to resin portions on both sides of the electronic component 30 in a laminating direction can be decreased. As a result, resin amount, flowing along an electrode forming face of the electronic part, can be decreased. In view of these, the stress acting on the electronic component 30 is decreased upon heating and pressurizing, thereby the electronic component 30 is prevented from being damaged. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
