发明名称 TEST PIECE TRANSPORTATION SYSTEM
摘要 PROBLEM TO BE SOLVED: To provide a wafer transportation system allowing the precise inspection of wafers or the like to be performed in manufacturing in line without largely changing a manufacturing process. SOLUTION: A test piece transportation system is used for a manufacturing process of semiconductor test pieces W such as wafers, and provided with a transportation mechanism 2 for transporting the semiconductor test piece W from one process location to the other process location and an SEM 3 provided on a transportation path of the transportation mechanism 2. The system is formed in such a manner as to temporarily stop the transfer of the semiconductor test piece W by the transportation mechanism 2 at an analyzing position P that is set in the transportation path and perform analyzing inspection by the SEM 3 at the stopping time. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008141141(A) 申请公布日期 2008.06.19
申请号 JP20060328722 申请日期 2006.12.05
申请人 HORIBA LTD;OKUTEKKU:KK 发明人 NISHIKATA KENTARO;OKUMURA KATSUYA
分类号 H01L21/677;H01J37/20;H01L21/66 主分类号 H01L21/677
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