| 摘要 |
<p>The invention relates to the collective manufacturing of n 3D modules. It comprises a manufacturing stage of a batch of n wafers i on the same plate, of the same thickness, and comprised of silicon, covered on one test point side face (20) then an insulating layer (4) of e thickness, forming the insulating substrate and equipped with at least one electronic component (11 ) connected to the test points (20) by means of the said insulating layer, with the components being separated from each other by primary grooves (30) with a width L1, and with the connecting points of the components (2) being connected to the tracks (3) that are flush with the level of the grooves (30), (B1) a stage depositing an adhesive support (40) on the component-side face, C1 ) a stage withdrawing the silicon plate (10) so as to show the test points (20), D1 ) a stage testing the electronic components of the plate by means of the test points (20), and marking of the valid components (11 '), E1 ), a stage for reporting on an adhesive film (41), the wafers (50) each comprising a valid component (11 '), with the wafers being separated by the secondary grooves (31) at the level at which the conductive tracks (3) of the valid components (11 ') appear. This stage, repeated K times, is followed by a stage of stacking the K plates, by making metalized holes in the thickness of the stack which are intended for connecting the wafers between the K plates, then cutting the stack to obtain the n 3D modules.</p> |
