| 摘要 |
<P>PROBLEM TO BE SOLVED: To make it hard for resist residues to occur when a plating resist film for forming a cylindrical electrode is exfoliated in a method for manufacturing a semiconductor device called CSP equipped with a columnar electrode. <P>SOLUTION: On the top surface of a protective film 5 including a wire 8, an overcoat film 9 made of polyimide based resin and having an opening 10 at a portion corresponding to a connection pad portion of the wire 8 is formed. Next, a plating resist film 25 having a backing metal layer 11 and an opening 26 is formed. Next, by electrolytically plating copper using the backing metal layer 11 as a plating current path, a columnar electrode composed of a lower columnar electrode 12a and an upper columnar electrode portion 12b is formed on the connection pad portion of the wire 8 in the opening 10 of the overcoat film 9. In this case, there is no room between the wires 8 for the plating resist film 25 to invade, and therefore, it is possible to make it hard for resist residues to occur when the plating resist film 25 is exfoliated. <P>COPYRIGHT: (C)2008,JPO&INPIT |
