| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board manufacturing method capable of laminating/bonding an internal layer base material and an external layer base material with a uniform pressure and of removing easily and precisely a resin film corresponding to a lead portion, an interlayer adhesive layer, and the external layer base material from the lead pattern portion. SOLUTION: A cover lay 14 is adhered to a conductor layer (internal layer circuit pattern 12c, internal circuit pattern 13c, lead pattern 12t) of a portion other than an exposed portion 12tt. A dummy pattern 23 for determining a position where a resin film 26 corresponding to the lead portion is adhered is formed on the external layer material 20. The interlayer adhesive layer 25 is laminated on the surface where the dummy pattern 23 is formed. After the resin film 26 corresponding to the lead portion is adhered to the interlayer adhesive layer 25, the resin film 26 corresponding to the lead is aligned to a lead pattern portion At. Then, the external layer base material 20 is laminated/adhered to the internal layer base material 10 via the interlayer adhesive layer 25. COPYRIGHT: (C)2008,JPO&INPIT |
