发明名称 Heat-Activatable Adhesive Tape for Flexible Printed Circuit Board (Fpcb) Bondings
摘要 Heat-activatable adhesive substance comprised of: i) an acrylate-containing block copolymer in a proportion of 40 to 98% by weight, ii) one or more tackifying epoxy resins and/or novolak resins and/or phenolic resins in a proportion of 2 to 60% by weight, and iii) optionally a curing agent for cross-linking the epoxy resins and/or novolak resins and/or phenolic resins, in a proportion of 0 to 10% by weight.
申请公布号 US2008146747(A1) 申请公布日期 2008.06.19
申请号 US20050722104 申请日期 2005.12.22
申请人 TESA AG 发明人 HUSEMANN MARC
分类号 C08G65/34 主分类号 C08G65/34
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