| 摘要 |
PROBLEM TO BE SOLVED: To provide a horizontal electroplating/electrodeposition method on a substrate and to provide a horizontal electroless plating method. SOLUTION: Equipment is one kind of horizontal electroplating equipment and mainly includes a set of plates for backing a plating solution and controlling the flow of the plating solution, a set of first electrodes, a set of net-like, planar or needle-like second electrodes, and electrode regeneration and plating solution recovery systems. When a substrate is horizontally sent into a predetermined position, the substrate is put between the plates for backing the plating solution and controlling the flow of the plating solution and a contact cathode, and held by them; thereby an electrical conduction is made. Further, an electroplating environment is established by bringing the substrate into electrical contact with an upper side anode by pouring the plating solution, and then one surface of the substrate is electroplated. Alternatively, an electrodeposition environment is established by bringing the substrate into electrical contact with an upper side cathode by pouring an electrodeposition liquid, and electrodeposition of a color filter pigment, a dye or a conductive photoresist is carried out on one surface of the substrate on the anode side. COPYRIGHT: (C)2008,JPO&INPIT
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