发明名称 |
METHOD FOR MANUFACTURING MULTILAYER FLEXIBLE PRINTED CIRCUIT BOARD |
摘要 |
The present inventions relates to a method for manufacturing a multilayer FPCB. The method includes the steps of providing three copper clad laminates and two binder layers, each of the copper clad laminates includes a dielectric layer and at least one patterned conductive layer formed on the dielectric layer; stacking the copper clad laminates and the binder layers alternately one on another; aligning the copper clad laminates and the binder layers; and compressing the copper clad laminates and the binder layers together thereby obtaining a multilayer flexible printed circuit board.
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申请公布号 |
US2008141527(A1) |
申请公布日期 |
2008.06.19 |
申请号 |
US20070861650 |
申请日期 |
2007.09.26 |
申请人 |
FOXCONN ADVANCED TECHNOLOGY INC. |
发明人 |
LIN CHENG-HSIEN;LEE WEN-CHIN |
分类号 |
H05K3/46 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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