发明名称 |
Light emitting diode package and method of manufacturing the same |
摘要 |
An LED package comprises a frame having a concave portion formed in the center thereof; one or more LED chips mounted on the bottom surface of the concave portion; and a lens filled in the concave portion, the lens having an upper surface formed of continuous prismatic irregularities forming concentric circles.
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申请公布号 |
US2008142822(A1) |
申请公布日期 |
2008.06.19 |
申请号 |
US20070826248 |
申请日期 |
2007.07.13 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM HYUN JUN;CHOI CHANG HWAN;LEE JONG MYEON;KIM DONG WOOHN;MOON WON HA |
分类号 |
H01L33/22;H01L33/54;H01L33/56;H01L33/60 |
主分类号 |
H01L33/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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