| 摘要 |
A semiconductor system having a substrate ( 101 ) including a rigid insulating interposer ( 110 ) with a high modulus and a top ( 140 ) and a bottom ( 150 ) low-modulus tape with flip-attached semiconductor chips ( 120, 130 ). The assembled chips, with the passive surfaces facing each other, are located in an opening ( 114 ) of the interposer, which has a thickness ( 111 ) equal to or smaller than the sum of the assembled two chips. Adhesive material ( 160 ) holds the tapes parallel to the interposer and the chip surfaces together. Solder balls ( 180 ) and discrete components ( 170 ) may be attached to the outside surfaces of the tapes.
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