发明名称 |
ACTIVELY CHILLED SUBSTRATE TRANSPORT MODULE |
摘要 |
A substrate transport module adapted to transport a substrate in a processing chamber of a semiconductor processing apparatus. The substrate transport module includes a substrate cooling surface and a plurality of coolant channels disposed in the substrate transport module and in thermal communication with the substrate cooling surface. The substrate transport module also includes a plurality of vacuum channels disposed in the substrate transport module and a plurality of proximity pins extending to a predetermined height above the substrate cooling surface. Each of the plurality of proximity pins is in fluid communication with one or more of the plurality of vacuum channels.
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申请公布号 |
US2008145191(A1) |
申请公布日期 |
2008.06.19 |
申请号 |
US20070689372 |
申请日期 |
2007.03.21 |
申请人 |
SOKUDO CO., LTD. |
发明人 |
SALINAS MARTIN JEFF;ISHIKAWA TETSUYA;QUACH DAVID H.;RAMANAN NATARAJAN |
分类号 |
H01L21/677 |
主分类号 |
H01L21/677 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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