METHOD FOR SEPARATING BONDED SUBSTRATES, APPARATUS FOR SEPARATING BONDED SUBSTRATES AND COMPUTER READABLE RECORDING MEDIUM HAVING PROGRAM RECORDED THEREON

摘要

Bonded substrates are held by suction on a lower chuck in a processing chamber. An upper chuck is brought down to hold the upper surface of the bonded substrates by suction. The bonded substrates are heated to a melting point of an adhesive or higher, and the adhesive is melted. The inside of the processing chamber is depressurized, the upper chuck is brought up in such state, the upper substrate of the bonded substrates is pulled upward to be removed from the lower substrate, and the bonded substrates are separated. Thus, the bonded substrates can be separated in the vertical direction with a small force.