发明名称 COATINGS FOR COMPONENTS OF SEMICONDUCTOR WAFER FABRICATION EQUIPMENT
摘要 <p>A method of forming a high wear resistance coating on a substrate having a low coefficient of thermal expansion is described. The method may include providing the low CTE substrate, where a surface of the substrate includes a plurality of protrusions raised above the surface. A high wear resistance layer is formed on a top portion of protrusions, where the layer is not contiguous between adjacent protrusions on the substrate. Also, a wafer support component to support a wafer during, for example, a photolithography or inspection process. The wafer support component includes a substrate that has a material with a low coefficient of thermal expansion, where the substrate has a surface with a plurality of protrusions raised about the surface. A high wear resistance layer is formed on a top surface of each of the protrusions.</p>
申请公布号 WO2008073722(A1) 申请公布日期 2008.06.19
申请号 WO2007US86033 申请日期 2007.11.30
申请人 COORSTEK, INC.;WILLIAMS, STEVEN, C. 发明人 WILLIAMS, STEVEN, C.
分类号 B05D1/02 主分类号 B05D1/02
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