METHOD FOR MANUFACTURING LED PACKAGE

摘要

A method for fabricating an LED(light emitting diode) is provided to avoid variation of the color coordinates of the light emitted from an LED by uniformly distributing a phosphor in an LED package. Phosphor paste(280) in which a phosphor is distributed is injected to the surface of an LED chip to form a phosphor layer on the surface of the LED chip. The LED chip is encapsulated by light transmitting molding resin. The phosphor paste can be injected through a mask(260) that is disposed on the LED chip to selectively expose the LED chip.