| 摘要 |
A multi-chip package having semiconductor chips sharing temperature information is provided to change characteristics of semiconductor chips by sharing one temperature sensing circuit with plural semiconductor chips. A multi-chip package includes a substrate(110), plural semiconductor chips(120,150), and a temperature sensing circuit(130). The semiconductor chips are sequentially laminated and implemented on the substrate. The temperature sensing circuit is implemented on one semiconductor chip. The semiconductor chip, where no temperature sensing circuit is implemented, is electrically connected to the temperature sensing circuit, which is formed on one of the semiconductor chips, such that temperature data from the temperature sensing circuit is shared by the semiconductor chips. |
