Multilayer printed circuit forming method for electronic device, involves piercing circuit to perform metallization of hole, and cleaning and metallizing boring, where diameter of boring is larger than/equal to its depth

摘要

The method involves pressing double face elementary circuits, where one of the circuits has a plated-through hole (12). The pressed circuit is pierced so as to perform metallization of the hole. A blind boring obtained from piercing is cleaned and metallized, where the boring has a diameter larger than or equal to its depth. A blind end of the boring is located between two layers (4, 5) of the circuit having the hole.