| 摘要 |
PROBLEM TO BE SOLVED: To provide a sealing structure in which a sealing state between a housing and a sealing member is superior by suppressing thermal effects in integrally molding the sealing member onto a flexible wiring board, as much as possible. SOLUTION: The sealing structure comprises a housing through which the flexible wiring board penetrates, and a sealing member molded integrally with the flexible wiring board and hermetically sealing a gap between the housing and the flexible wiring board. The flexible wiring board comprises a base substrate, constituted of an elastic member, a conductive printed wiring layer formed on the surface of the base substrate, and a cover film for covering the surface of the printed wiring layer. The printed wiring layer, existing on a region that crosses the sealing member is formed, in such a way that only the vicinity of the region, crossing the sealing member, is formed of a plurality of divided printed wiring layers. COPYRIGHT: (C)2008,JPO&INPIT
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