| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating tool which can control the pressing force against a wafer and attach or detach the wafer rapidly. SOLUTION: The plating tool 1 is constituted of a tool body 3 equipped with a plurality of feeding electrodes 11 installed along the peripheral edge of a plating hole part 9, a first annular seal member 17 arranged on the tool body 3 along the peripheral edge of the plating hole part 9 for mounting a wafer 7 in such a manner that the surface of the wafer 7 is connected to the feeding electrodes 11, a pressing member 25 for abutting on the rear surface of the wafer 7 to press the wafer 7 to the first seal member 17, a cover member 31 for covering the whole of the rear surface of the wafer 7 through an energizing means 33 for energizing the pressing member 25 toward the first seal member 17, a second seal member 27 arranged along the outer circumference of the pressing member 25 between the cover member 31 and the tool body 3, and a catch device 39 for positioning the cover member 31 relative to the tool body 3 to tightening the cover member 31 and the tool body 3 against the energizing force of the energizing means 33. COPYRIGHT: (C)2008,JPO&INPIT
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