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发明名称
CMP METHODE VON EINEM SUBSTRAT MIT EINER POLIERSCHEIBE MIT FIXIERTEM SCHLEIFMITTEL
摘要
申请公布号
DE69738133(T2)
申请公布日期
2008.06.12
申请号
DE1997638133T
申请日期
1997.10.17
申请人
MICRON TECHNOLOGY INC.
发明人
HUDSON, GUY F.
分类号
H01L21/321;B24B37/24;H01L21/304;H01L21/306;H01L21/3105
主分类号
H01L21/321
代理机构
代理人
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地址
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